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Gold Tin Solder Paste, Flux Free (AuSn) 15-20um, 99.9%

Quantity Discount (%) Price
1 - 9 — £145.00
10 - 14 3.45 % £140.00
15 - 19 6.9 % £135.00
20 - 24 10.34 % £130.00
25+ 13.79 % £125.00
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Safety Information

NONH for multimodal transport

Sold per Gram pack. MOQ = 5 grams. Bulk pricing available on request.

Description

Gold Tin Solder Paste, Flux Free (Au/Sn) 15-20um, 99.9%
Indication NS6130-01-157/3
Alloy Sn20/Au80 (Standard)
Sn25/Au75 (upon request)
Other alloys are available on request
Physical Properties
Particle Size 15-20um
Shape Spherical
Melting Point Sn20/Au80 = 217°C
Sn25/Au75 = 217°C
Composition Sn20/Au80
Density Sn20/Au80 = 7.4 g/cc
Sn25/Au75 = 7.4 g/cc
Solder Paste
Metal Content Standard 89% ± 1%
Viscosity Range 130 ± 40 Pas
Physica CSS 10 s-1
Density 3.99 ± 0.2 g/ml
Performance Properties
Typical Print Thickness 0.4 – 0.65 mm pitch: 150 microns
<0.4 mm pitch: 120 microns
Minimum Pitch 16 mil (400 microns)
Minimum Pad Width

Quantities

INSCX Thematic

 8 mil (200µm, Stencil Thickness -150 µm

5Gms, 10Gms +

Mixed Metal Alloys

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