Description
| Material | High Purity Copper Ink (Cu), 99.9 %, 80nm, 5%wt | |
| Stock No | NS6130-04-476 | |
| APS | 80-100nm | Confirm |
| CAS | 7440-50-8 | Confirm |
| Purity | 99.9% | Confirm |
| Color | Liquid Brown | Confirm |
| Viscosity | 10-20 cP | Confirm |
| Surface Tension | 30-32 dynes/cm | Confirm |
| Metal Loading | 10-30 % | Confirm |
| Resistivity | 1.7×10-8 Ωm | Confirm |
| Typical Cured Thickness | 70µm | Confirm |
| Concentration | <5% (Available as per Customer requirement) | |
| Dispersing Agent | Organic Solvent (DMF), IPA Ethanol, Water (ddH2O) | |
| Available Quantities | 25ml, 50ml, 100ml, 250ml + | |
| INSCX Thematic | Dispersions (Metals) | |
Typical Chemical Analysis
| Cu | 99.9 % |
| As | <10ppm |
| Cd | <10ppm |
| Hg | <10ppm |
| Pb | <10ppm |
| Ni | <90ppm |
| Fe | <170ppm |
| Sn | <30ppm |
| Sb | <10ppm |
| Mn | <45ppm |
| Zn | <50ppm |


