Description
Material |
High Purity Copper Ink (Cu), 99.9 %, 80nm, 5%wt |
Stock No |
NS6130-04-476 |
APS |
80-100nm |
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CAS |
7440-50-8 |
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Purity |
99.9% |
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Color |
Liquid Brown |
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Viscosity |
10-20 cP |
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Surface Tension |
30-32 dynes/cm |
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Metal Loading |
10-30 % |
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Resistivity |
1.7×10-8 Ωm |
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Typical Cured Thickness |
70µm |
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Concentration |
<5% (Available as per Customer requirement) |
Dispersing Agent |
Organic Solvent (DMF), IPA Ethanol, Water (ddH2O) |
Available Quantities |
25ml, 50ml, 100ml, 250ml + |
INSCX Thematic |
Dispersions (Metals) |
Typical Chemical Analysis
Cu |
99.9 % |
As |
<10ppm |
Cd |
<10ppm |
Hg |
<10ppm |
Pb |
<10ppm |
Ni |
<90ppm |
Fe |
<170ppm |
Sn |
<30ppm |
Sb |
<10ppm |
Mn |
<45ppm |
Zn |
<50ppm |